Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
09/20/2016
|
Application #:
|
14753311
|
Filing Dt:
|
06/29/2015
|
|
Publication #:
|
|
Pub Dt:
|
10/13/2016
| | | | |
|
Inventors:
|
Tong Lei, Jingxun Fang
|
|
Title:
|
METHOD FOR FORMING COBALT BARRIER LAYER AND METAL INTERCONNECTION PROCESS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 497 GAOSI ROAD, ZHANGJIANG HI-TECH PARK, PUDONG |
| SHANGHAI, CHINA |
|
|
|
|
| SHANGHAI HUALI MICROELECTRONICS CORPORATION |
| 497 GAOSI ROAD, ZHANGJIANG HI-TECH PARK, PUDONG |
| SHANGHAI, CHINA |
|
|
Search Results as of:
09/23/2024 10:24 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
