Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/05/2017
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Application #:
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15089630
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Filing Dt:
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04/04/2016
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Publication #:
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Pub Dt:
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10/13/2016
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Inventors:
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Shinji WATANABE, Toshihiro Iwasaki, Michiaki Tamakawa
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1913-2 FUKURA, USUKI-CITY |
| OITA, JAPAN 8750053 |
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| TYPHA IP LLC |
| 1819 L STREET NW SUITE 200 |
| WASHINGTON, DC 20036 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1913-2 TAKEGASHITA, FUKURA |
| USUKI-SHI |
| OITA, JAPAN 875-0053 |
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| KENNETH COOL |
| 558 CASTLE PINES PARKWAY |
| B4-362 |
| CASTLE PINES, CO 80108 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY NAME PREVIOUSLY RECORDED AT REEL: 53597 FRAME: 184. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 1913-2, TAKEGASHITA, FUKURA |
| USUKI-SHI |
| OITA, JAPAN 875-0053 |
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| KENNETH COOL |
| 558 CASTLE PINES PARKWAY |
| B4-362 |
| CASTLE PINES, CO 80108 |
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