Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15103318
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Filing Dt:
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06/10/2016
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Publication #:
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Pub Dt:
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10/20/2016
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Inventors:
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Hideta Arai, Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro
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Title:
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Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring Board, Electronic Apparatus and Method for Manufacturing Printed Wiring Board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 1008164 |
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| NIELDS, LEMACK & FRAME, LLC |
| 176 E. MAIN STREET |
| SUITE 5 |
| WESTBORO, MA 01581 |
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