Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/07/2018
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Application #:
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15203803
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Filing Dt:
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07/07/2016
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Publication #:
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Pub Dt:
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10/27/2016
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Inventors:
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Hamza Yilmaz, Jun Lu, Yan Huo, Ming-Chen Lu, Yan Xun Xue, Peter Wilson, Zhiqiang Niu
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Title:
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Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device with Multiple Interconnecting Structures
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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475 OAKMEAD PKWY |
SUNNYVALE, CALIFORNIA 94085 |
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CHEN-CHI LIN |
1119 QUAIL CREEK CIRCLE |
SAN JOSE, CA 95120 |
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