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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/30/2017
Application #:
15203045
Filing Dt:
07/06/2016
Publication #:
Pub Dt:
10/27/2016
Inventors:
CHIU-JUNG CHEN, SHIU-KO JANGJIAN, HSIN-CHI CHEN, CHEN-CHUN CHEN, FU-TSUN TSAI et al
Title:
MANUFACTURING METHOD OF FORMING A SEMICONDUCTOR WAFER STRUCTURE
Assignment: 1
Reel/Frame:
039087/0194Recorded: 07/06/2016Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/29/2014
Exec Dt:
01/29/2014
Exec Dt:
02/06/2014
Exec Dt:
01/29/2014
Exec Dt:
02/07/2012
Exec Dt:
01/29/2014
Assignee:
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
2301 DUPONT DR. SUITE 510
IRVINE, CA 92612

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