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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
15224831
Filing Dt:
08/01/2016
Publication #:
Pub Dt:
11/24/2016
Inventors:
ROLAND MAYERHOFER, RICHARD HENDEL, WENJIE ZHU
Title:
Method for removing dielectric layers from semiconductor components by using a laser beam
Assignment: 1
Reel/Frame:
039497/0021Recorded: 08/22/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/09/2016
Exec Dt:
08/12/2016
Exec Dt:
08/07/2016
Assignee:
PETERSBRUNNER STR. 1B
STARNBERG, GERMANY D-82319
Correspondent:
LERNER GREENBERG STEMER LLP
P.O. BOX 2480
HOLLYWOOD, FL 33022-2480

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