Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/31/2018
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Application #:
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14860723
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Filing Dt:
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09/22/2015
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Publication #:
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Pub Dt:
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11/24/2016
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Inventors:
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Jui-Chieh Chiu, Chih-Wen Huang, Fan-Hsiu Huang
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Title:
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Package Structure and Three Dimensional Package Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK, KUEI SHAN DIST. |
| TAO YUAN CITY, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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