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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14889260
Filing Dt:
11/05/2015
Publication #:
Pub Dt:
12/01/2016
Inventors:
Clayton Arthur Ownby, Grant O. Cook III, Jeffrey G. Thomas et al
Title:
THERMAL SINK SYSTEMS FOR COOLING A MOLD ASSEMBLY
Assignment: 1
Reel/Frame:
036969/0902Recorded: 11/05/2015Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/24/2014
Exec Dt:
11/07/2014
Exec Dt:
11/07/2014
Exec Dt:
12/16/2014
Assignee:
3000 N. SAM HOUSTON PARKWAY E.
HOUSTON, TEXAS 77032-3219
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001

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