Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/25/2017
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Application #:
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15068212
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Filing Dt:
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03/11/2016
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Publication #:
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Pub Dt:
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12/01/2016
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Inventors:
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Zhengfen Wan, Zhenqing Zhao, Wei Cheng, Tao Wang, Haibin Xu
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Title:
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PACKAGE STRUCTURE WITH AN ELASTOMER WITH LOWER ELASTIC MODULUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1675, HAUDONG ROAD, PUDONG |
SHANGHAI, CHINA 201209 |
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EVAN R. WITT |
60 EAST SOUTH TEMPLE |
1800 WORLD TRADE CENTER |
SALT LAKE CITY, UT 84111 |
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