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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
15117345
Filing Dt:
08/08/2016
Publication #:
Pub Dt:
12/01/2016
Inventors:
Sung Wuk RYU, Dong Sun KIM, Ji Haeng LEE, Sang Hyuck NAM
Title:
PRINTED CIRCUIT BOARD, PACKAGE SUBSTRATE AND PRODUCTION METHOD FOR SAME
Assignment: 1
Reel/Frame:
039807/0156Recorded: 08/24/2016Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/09/2016
Exec Dt:
08/09/2016
Exec Dt:
08/09/2016
Exec Dt:
08/09/2016
Assignee:
SEOUL SQUARE, 416, HANGANG-DAERO, JUNG-GU
SEOUL, KOREA, REPUBLIC OF 04637
Correspondent:
KED & ASSOCIATES, LLP
P.O. BOX 8638
RESTON, VA 20195

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