Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/14/2017
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Application #:
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14753869
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Filing Dt:
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06/29/2015
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Publication #:
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Pub Dt:
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12/29/2016
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Inventors:
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Ki Myung NAM, Young Woon JEON, Kyoung Ja YUN
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Title:
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CHIP SUBSTRATE COMPRISING A PLATED LAYER AND CHIP PACKAGE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 89, ASAN VALLEY-RO, DUNPO-MYEON |
| CHUNGCHEONGNAM-DO |
| ASAN-SI, KOREA, REPUBLIC OF 336-875 |
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| ROBERT M. ASHER |
| 125 SUMMER STREET |
| SUNSTEIN KANN MURPHY & TIMBERS LLP |
| BOSTON, MA 02110 |
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