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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/06/2017
Application #:
14754769
Filing Dt:
06/30/2015
Publication #:
Pub Dt:
01/05/2017
Inventors:
Shih-Ming Chang, Chien-Fu Lee, Chin-Yuan Tseng
Title:
Method for Integrated Circuit Manufacturing
Assignment: 1
Reel/Frame:
036548/0246Recorded: 09/12/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/14/2015
Exec Dt:
07/14/2015
Exec Dt:
07/14/2015
Assignee:
NO. 8, LI-HSIN ROAD 6,
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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