Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/08/2019
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Application #:
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15198945
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Filing Dt:
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06/30/2016
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Publication #:
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Pub Dt:
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01/12/2017
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Inventors:
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Randy A. Harris, Michael Windham
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Title:
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WAFER ELECTROPLATING CHUCK ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| KENNETH H. OHRINER |
| POST OFFICE BOX 1247 |
| SEATTLE, WA 98111-1247 |
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