Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2017
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Application #:
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15205337
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Filing Dt:
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07/08/2016
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Publication #:
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Pub Dt:
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01/19/2017
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Inventors:
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Jong-Rip KIM, Jong-Myeon LEE, Doo-Hwan LEE
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Title:
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ELECTRONIC COMPONENT PACKAGE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO 16674 |
SUWON-SI, KOREA, REPUBLIC OF |
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NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
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