Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/14/2017
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Application #:
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14815584
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Filing Dt:
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07/31/2015
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Publication #:
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Pub Dt:
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02/02/2017
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Inventors:
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Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen
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Title:
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Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE 4TH & 5TH INVENTOR'S NAME FROM "HSIEN-WEI CHEN CHEN" TO HSIEN-WEI CHEN & "MING-DA CHENG CHENG" TO "MING-DA CHENG" PREVIOUSLY RECORDED AT REEL: 036530 FRAME: 0739. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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