Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2019
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Application #:
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14981338
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Filing Dt:
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12/28/2015
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Publication #:
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Pub Dt:
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02/23/2017
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Inventor:
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Jing-En LUAN
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Title:
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SEMICONDUCTOR DIE ATTACHMENT WITH EMBEDDED STUD BUMPS IN ATTACHMENT MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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| KAREN M. HENCKEL |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEED IP LAW GROUP PLLC |
| SEATTLE, WA 98104 |
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