Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/11/2020
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Application #:
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14833549
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Filing Dt:
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08/24/2015
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Publication #:
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Pub Dt:
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03/02/2017
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Inventors:
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Aaron Collins, Paul Davidson, Ralph Smith
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Title:
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METHOD OF FORMING ELECTRICAL CONNECTIONS WITH SOLDER DISPENSING AND REFLOW
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10200 S. DE ANZA BLVD. |
| CUPERTINO, CALIFORNIA 95014 |
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| KAGAN BINDER, PLLC / STL MAPLE ISLAND BU |
| 221 MAIN STREET NORTH |
| SUITE 200 |
| STILLWATER, MN 55082 |
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