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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/27/2017
Application #:
14840364
Filing Dt:
08/31/2015
Publication #:
Pub Dt:
03/02/2017
Inventors:
Ta-Pen Guo, Carlos H. Diaz, Jean-Pierre Colinge, Yi-Hsiung Lin
Title:
MONOLITHIC 3D INTEGRATION INTER-TIER VIAS INSERTION SCHEME AND ASSOCIATED LAYOUT STRUCTURE
Assignment: 1
Reel/Frame:
036704/0701Recorded: 10/01/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/01/2015
Exec Dt:
09/01/2015
Exec Dt:
09/01/2015
Exec Dt:
09/01/2015
Assignee:
NO. 8, LI-HSIN ROAD 6,
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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