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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14840365
Filing Dt:
08/31/2015
Publication #:
Pub Dt:
03/02/2017
Inventors:
Jen-Yi Chen, Chao-Sen Chang, Chun-Chieh Wang, Yong-Shiang Chang
Title:
MEMS MICROPHONE PACKAGE STRUCTURE HAVING A NON-PLANAR SUBSTRATE
Assignment: 1
Reel/Frame:
036486/0242Recorded: 09/03/2015Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/18/2015
Exec Dt:
08/18/2015
Exec Dt:
08/18/2015
Exec Dt:
08/18/2015
Assignee:
NO. 50 MEI BAO RD., DA LOUNG IND. PARK
LONG HUA BAOAN
SHANZHEN, CHINA
Correspondent:
BACON & THOMAS, PLLC
625 SLATERS LANE
4TH FLOOR
ALEXANDRIA, VA 22314-1176

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