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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/31/2018
Application #:
15356916
Filing Dt:
11/21/2016
Publication #:
Pub Dt:
03/09/2017
Inventor:
Daesung LEE
Title:
CMOS-MEMS INTEGRATED DEVICE WITH SELECTIVE BOND PAD PROTECTION
Assignment: 1
Reel/Frame:
040390/0200Recorded: 11/21/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/28/2015
Assignee:
1745 TECHNOLOGY DRIVE
SUITE 200
SAN JOSE, CALIFORNIA 95110
Correspondent:
AMIN, TUROCY & WATSON, LLP
127 PUBLIC SQUARE
57TH FLOOR, KEY TOWER
CLEVELAND, OH 44114

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