Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/24/2018
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Application #:
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15093175
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Filing Dt:
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04/07/2016
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Publication #:
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Pub Dt:
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04/13/2017
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Inventors:
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Chang-han TSAI, Shui-Fa TSAI
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Title:
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HEAT DISSIPATING MODULE, HEAT DISSIPATING SYSTEM AND CIRCUIT MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F., NO. 788-1, CHUNG-CHENG RD., ZHONGHE DIST. |
| NEW TAIPEI CITY, TAIWAN 235 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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