Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/03/2018
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Application #:
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15293902
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Filing Dt:
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10/14/2016
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Publication #:
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Pub Dt:
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04/20/2017
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Inventors:
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Kandabara N. Tapily, Gerrit J. Leusink, Kai-Hung Yu, Robert D. Clark
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Title:
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SELECTIVE BOTTOM-UP METAL FEATURE FILLING FOR INTERCONNECTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AKASAKA BIZ TOWER |
| 3-1 AKASAKA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN 107-6325 |
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| TOKYO ELECTRON U.S. HOLDINGS, INC. |
| 2400 GROVE BLVD. |
| AUSTIN, TX 78741 |
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