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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9640498
Issue Dt:
05/02/2017
Application #:
14918256
Filing Dt:
10/20/2015
Publication #:
20170110425
Pub Dt:
04/20/2017
Inventors:
Chang-Pin Huang, Chen-Hua Yu, Ching-Jung Yang, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo et al
Title:
INTEGRATED FAN-OUT (INFO) PACKAGE STRUCTURES AND METHODS OF FORMING SAME
Assignment: 1
Reel/Frame:
036837/0161Recorded: 10/20/2015Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HUANG, CHANG-PIN
Exec Dt:
10/08/2015
YU, CHEN-HUA
Exec Dt:
10/08/2015
YANG, CHING-JUNG
Exec Dt:
10/08/2015
LIU, CHUNG-SHI
Exec Dt:
10/12/2015
TU, HSIEN-MING
Exec Dt:
10/12/2015
KUO, HUNG-YI
Exec Dt:
10/12/2015
TSAI, HAO-YI
Exec Dt:
10/12/2015
LIANG, SHIH-WEI
Exec Dt:
10/12/2015
LAI, YU-CHIA
Exec Dt:
10/12/2015
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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