Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2017
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Application #:
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15140452
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Filing Dt:
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04/27/2016
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Publication #:
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Pub Dt:
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04/27/2017
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Inventors:
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Yang Zhao, Piu Francis Man, Leyue Jiang, Haidong Liu, Bin Li
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Title:
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Method For Wafer-Level Chip Scale Package Testing
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2 XINHUIHUAN ROAD |
| NEW DISTRICT |
| WUXI, CHINA 214028 |
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| HAN IP CORPORATION |
| 4790 IRVINE BOULEVARD SUITE 105-347 |
| IRVINE, CA 92620 |
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06/27/2024 06:47 PM
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