Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2017
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Application #:
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14930912
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Filing Dt:
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11/03/2015
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Publication #:
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Pub Dt:
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05/04/2017
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Inventors:
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Chun-Sheng Fan, Wei-Feng Lin
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Title:
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Chip-Scale Packaged Image Sensor Packages With Black Masking And Associated Packaging Methods
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4275 BURTON DRIVE |
SANTA CLARA, CALIFORNIA 95054 |
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CURTIS A. VOCK LATHROP & GAGE LLP |
4845 PEARL EAST CIRCLE |
SUITE 201 |
BOULDER, CO 80301 |
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