Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/06/2018
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Application #:
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15247959
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Filing Dt:
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08/26/2016
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Publication #:
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Pub Dt:
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05/25/2017
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Inventors:
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Bin WU, Tsung-Yu LI
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Title:
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MANUFACTURING METHOD, PICKUP METHOD, EQUIPMENT AND EMI (ELECTROMAGNETIC INTERFERENCE) ELECTROMAGNETIC SHIELDING LAYER MANUFACTURING METHOD OF SIP (SYSTEM IN PACKAGE) MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 501, LONGGUI ROAD, JINQIAO EXPORT PROCESSING (SOUTH) ZONE, |
| PUDONG NEW AREA, SHANGHAI, CHINA 201201 |
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| GLOBAL IP SERVICES, PLLC |
| 121 MOORE ST |
| PRINCETON, NJ 08540 |
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