Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/02/2019
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Application #:
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15336826
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Filing Dt:
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10/28/2016
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Publication #:
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Pub Dt:
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06/01/2017
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Inventors:
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XI-HANG LI, BING LIU, WEI WU, QING-LEI PAN, SHI-LI ZHANG, YUAN GAO
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Title:
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CLAMPING DEVICE FOR SOLDERING OPERATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| COMPREHENSIVE BONDED AREA,EAST-SIDE OF ZHENXING RD,ZHENGZHOU AIRPORT DISTRICT, CHINA |
| ZHENGZHOU, CHINA |
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| 66, CHUNG SHAN ROAD, TU-CHENG DIST. |
| NEW TAIPEI, TAIWAN |
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| ZHIGANG MA |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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