Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/24/2018
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Application #:
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15264492
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Filing Dt:
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09/13/2016
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Publication #:
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Pub Dt:
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06/15/2017
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Inventors:
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Daniel C. Edelstein, Chih-Chao Yang
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Title:
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NITRIDE-ENRICHED OXIDE-TO-OXIDE 3D WAFER BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| SHERMAN IP LLP (IBM7) |
| 1519 26TH STREET |
| SANTA MONICA, CA 90404 |
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