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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9929099
Issue Dt:
03/27/2018
Application #:
15357299
Filing Dt:
11/21/2016
Publication #:
20170170184
Pub Dt:
06/15/2017
Inventors:
VietHa Nguyen, Wookyung You, Inoue Naoya, Hak-Sun Lee, Byung-Kwon Cho, Songyi Han et al
Title:
PLANARIZED INTERLAYER DIELECTRIC WITH AIR GAP ISOLATION
Assignment: 1
Reel/Frame:
040398/0717Recorded: 11/22/2016Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NGUYEN, VIETHA
Exec Dt:
07/12/2016
YOU, WOOKYUNG
Exec Dt:
07/12/2016
NAOYA, INOUE
Exec Dt:
07/12/2016
LEE, HAK-SUN
Exec Dt:
07/12/2016
CHO, BYUNG-KWON
Exec Dt:
07/26/2016
HAN, SONGYI
Exec Dt:
07/26/2016
BAEK, JONGMIN
Exec Dt:
07/12/2016
KANG, JIWON
Exec Dt:
07/12/2016
KIM, BYUNGHEE
Exec Dt:
07/12/2016
PARK, YOUNG-JU
Exec Dt:
07/12/2016
AHN, SANGHOON
Exec Dt:
07/29/2016
YUN, JIWON
Exec Dt:
07/26/2016
LEE, NAEIN
Exec Dt:
07/12/2016
CHO, YOUNGWOO
Exec Dt:
07/12/2016
Assignee:
SAMSUNG ELECTRONICS CO.,LTD.
129, SAMSUNG-RO,YEONGTONG-GU, GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF
Correspondent:
ANTHONY P. ONELLO, JR.
THREE BURLINGTON WOODS DRIVE
SUITE 203
BURLINGTON, MA 01803

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