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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14982103
Filing Dt:
12/29/2015
Publication #:
Pub Dt:
06/29/2017
Inventors:
Laurent HERARD, David GANI
Title:
METHOD FOR MAKING AN INTEGRATED CIRCUIT (IC) PACKAGE WITH AN ELECTRICALLY CONDUCTIVE SHIELD LAYER
Assignment: 1
Reel/Frame:
037632/0040Recorded: 02/01/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/2016
Exec Dt:
01/05/2016
Assignee:
28 ANG MO KIO
INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569508
Correspondent:
CHRISTOPHER F. REGAN
255 S. ORANGE AVE.
STE. 1401
ORLANDO, FL 32801

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