Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/13/2018
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Application #:
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15493133
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Filing Dt:
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04/21/2017
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Publication #:
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Pub Dt:
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08/03/2017
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Inventors:
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R. Scott West, Tao Tong, Mike Kwon, Michael Solomensky
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Title:
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Packaging a Substrate with an LED into an Interconnect Structure Only Through Top Side Landing Pads on the Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 PORTOLA AVENUE |
| LIVERMORE, CALIFORNIA 94551 |
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| IMPERIUM PATENT WORKS |
| P.O. BOX 607 |
| PLEASANTON, CA 94566 |
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