Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/02/2018
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Application #:
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15600793
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Filing Dt:
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05/22/2017
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Publication #:
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Pub Dt:
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09/07/2017
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Inventors:
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Wen-Chun Liu, Wei-Jen Lai
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Title:
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PACKAGE STRUCTURE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.151, SEC. 4 , YIFENG RD., NANTUN DIST., |
TAICHUNG CITY, TAIWAN 40880 |
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
TAIPEI, TAIWAN |
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09/25/2024 01:45 PM
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