Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/31/2017
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Application #:
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15076386
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Filing Dt:
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03/21/2016
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Publication #:
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Pub Dt:
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09/21/2017
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Inventors:
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HONGWEN ZHANG, Ning-Cheng Lee
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Title:
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HYBRID LEAD-FREE SOLDER WIRE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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34 ROBINSON ROAD |
CLINTON, NEW YORK 13323 |
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SHEPPARD, MULLIN, RICHTER & HAMPTON LLP |
12275 EL CAMINO REAL, SUITE 200 |
SAN DIEGO, CA 92130 |
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