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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10074621
Issue Dt:
09/11/2018
Application #:
15181489
Filing Dt:
06/14/2016
Publication #:
20170278807
Pub Dt:
09/28/2017
Inventors:
Chih-Hsien Chiu, Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai, Chia-Yang Chen
Title:
ELECTRONIC PACKAGE WITH ANTENNA STRUCTURE
Assignment: 1
Reel/Frame:
038905/0001Recorded: 06/14/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHID, CHIH-HSIEN
Exec Dt:
03/08/2016
TSAI, CHI-PIN
Exec Dt:
03/08/2016
SHIH, CHI-LIANG
Exec Dt:
03/08/2016
TSAI, MING-FAN
Exec Dt:
03/08/2016
CHEN, CHIA-YANG
Exec Dt:
03/08/2016
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU
TAICHUNG, TAIWAN
Correspondent:
MINTZ LEVIN
ONE FINANCIAL CENTER
BOSTON, MA 02111
Assignment: 2
Reel/Frame:
039080/0438Recorded: 07/06/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHIU, CHIH-HSIEN
Exec Dt:
03/08/2016
TSAI, CHI-PIN
Exec Dt:
03/08/2016
SHIH, CHI-LIANG
Exec Dt:
03/08/2016
TSAI, MING-FAN
Exec Dt:
03/08/2016
CHEN, CHIA-YANG
Exec Dt:
03/08/2016
Assignee:
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU
TAICHUNG, TAIWAN
Correspondent:
MINTZ LEVIN
ONE FINANCIAL CENTER
BOSTON, MA 02111

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