Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/22/2019
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Application #:
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15094178
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Filing Dt:
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04/08/2016
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Publication #:
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Pub Dt:
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10/12/2017
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Inventors:
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Chang Chin TSAI, Hsun-Wei CHAN
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Title:
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LID ARRAY PANEL, PACKAGE WITH LID AND METHOD OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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FOLEY & LARDNER |
3000 K STREET N.W. |
SUITE 600 |
WASHINGTON, DC 20007 |
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