Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15644331
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Filing Dt:
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07/07/2017
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Publication #:
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Pub Dt:
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10/26/2017
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Inventors:
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Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K. N. Kumar et al
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Title:
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High Impact Solder Toughness Alloy
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 745 SEVENTH AVENUE |
| 27TH FLOOR |
| NEW YORK, NEW YORK 10019 |
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| LATHAM & WATKINS LLP C/O ANGELA M. AMARU |
| 885 THIRD AVENUE |
| NEW YORK, NY 10022 |
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Assignment:
2
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ASSIGNMENT OF SECURITY INTEREST IN PATENT COLLATERAL
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| 388 GREENWICH STREET |
| 7TH FLOOR |
| NEW YORK, NEW YORK 10013 |
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| LATHAM & WATKINS LLP C/O ANGELA M. AMARU |
| 1271 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10020 |
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