Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/2019
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Application #:
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15593140
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Filing Dt:
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05/11/2017
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Publication #:
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Pub Dt:
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11/16/2017
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Inventors:
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Il-Hwan KIM, Jun-Kyu LEE, Min-A YOON, Dong-Hoon OH, Tae-Won KIM
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 105, GEUMIL-RO 965BEON-GIL, SAMSEONG-MYEON, EUMSEONG-GUN |
| CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF 27651 |
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| LADAS & PARRY LLP |
| 5670 WILSHIRE BLVD. SUITE 2100 |
| LOS ANGELES, CA 90036 |
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