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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/16/2018
Application #:
15237639
Filing Dt:
08/16/2016
Publication #:
Pub Dt:
11/23/2017
Inventors:
Len-Yi Leu, Kai-Fung Chang, Lien-Yao Tsai
Title:
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
040026/0212Recorded: 10/17/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/12/2016
Exec Dt:
08/12/2016
Exec Dt:
08/12/2016
Assignee:
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 30078
Correspondent:
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
TAIPEI, TAIWAN

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