Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15165511
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Filing Dt:
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05/26/2016
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Publication #:
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Pub Dt:
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11/30/2017
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Inventor:
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Weng Foong Yap
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH SOLDER BALLS ON TWO SIDES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TEXAS 78735 |
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NXP B.V. |
6501 WILLIAM CANNON DRIVE WEST TX30/OE62 |
AUSTIN, TX 78735 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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6501 WILLIAM CANNON DRIVE WEST |
TX 30 OE:62 |
AUSTIN, TEXAS 78735 |
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NXP USA, INC. |
6501 WILLIAM CANNON DRIVE WEST |
TX 30 OE:62 |
AUSTIN, TX 78735 |
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