Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/09/2018
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Application #:
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15674449
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Filing Dt:
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08/10/2017
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Publication #:
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Pub Dt:
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12/07/2017
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Inventors:
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Saravuth Sirinorakul, Suebphong Yenrudee
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Title:
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SEMICONDUCTOR PACKAGE WITH MULTIPLE MOLDING ROUTING LAYERS AND A METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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22 ANG MO |
KIO INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569506 |
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THOMAS B. HAVERSTOCK |
162 N WOLFE ROAD |
SUNNYVALE, CA 94086 |
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09/23/2024 07:55 AM
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