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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/20/2019
Application #:
15620820
Filing Dt:
06/12/2017
Publication #:
Pub Dt:
12/14/2017
Inventors:
Changbao Ren, Kwok Keung Paul Ho, Haojun Zhu, Lai To Leung
Title:
THERMALLY CONDUCTIVE COMPOSITES AND METHOD OF PREPARING SAME
Assignment: 1
Reel/Frame:
042681/0076Recorded: 06/13/2017Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/05/2017
Exec Dt:
06/02/2017
Exec Dt:
06/06/2017
Exec Dt:
06/06/2017
Assignee:
UNITS 515-516, 5/F, LAKESIDE 1
NO. 8 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK, SHATIN, NEW TERRITORIES
HONG KONG, HONG KONG
Correspondent:
B.Y.I.P., LTD
P.O. BOX 1484
GENERAL POST OFFICE
HONG KONG, HONG KONG

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