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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/19/2019
Application #:
15694886
Filing Dt:
09/04/2017
Publication #:
Pub Dt:
12/21/2017
Inventors:
Peiwen Zhu, Zhaofeng Zeng
Title:
QSFP+ MODULE HOT-PLUGGABLE UNLOCKING STRUCTURE
Assignment: 1
Reel/Frame:
043480/0721Recorded: 09/05/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/24/2017
Exec Dt:
08/24/2017
Assignee:
#35 CUIJING ROAD, PINGSHAN NEW DISTRICT
SHENZHEN, GUANGDONG, CHINA 518118
Correspondent:
BYIP
P.O. BOX 1484
GENERAL POST OFFICE
HONG KONG, HONG KONG
Assignment: 2
Reel/Frame:
062836/0449Recorded: 02/23/2023Pages: 10
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/05/2022
Assignee:
NO. 35 CUIJING ROAD, PINGSHAN NEW DISTRICT
SHENZHEN, GUANGDONG, CHINA
Correspondent:
BYIP LTD.
5465 LEGACY DRIVE, SUITE 650
PLANO, TX 75024

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