Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2018
|
Application #:
|
15469594
|
Filing Dt:
|
03/27/2017
|
|
Publication #:
|
|
Pub Dt:
|
12/28/2017
| | | | |
|
Inventors:
|
Ting-Feng Su, Chia-Jen Chou
|
|
Title:
|
FAN-OUT WAFER LEVEL PACKAGE STRUCTURE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO.26, DATONG RD., HUKOU TOWNSHIP, |
| HSINCHU COUNTY, TAIWAN 303 |
|
|
|
|
| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, TAIWAN |
|
|
Search Results as of:
09/23/2024 08:22 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
