Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/20/2018
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Application #:
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15196558
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Filing Dt:
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06/29/2016
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Publication #:
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Pub Dt:
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01/04/2018
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Inventors:
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John U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
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Title:
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VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| PATRICK G. MURRAY |
| 48 SOUTH SERVICE ROAD, SUITE 100 |
| RYAN, MASON & LEWIS, LLP |
| MELVILLE, NY 11747 |
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