Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/16/2020
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Application #:
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15701456
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Filing Dt:
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09/12/2017
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Publication #:
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Pub Dt:
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01/04/2018
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Inventors:
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Shiann-Tsong Tsai, Hsueh-Te Wang
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Title:
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SEMICONDUCTOR CHIP PACKAGE WITH RESILIENT CONDUCTIVE PASTE POST AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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