Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/26/2019
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Application #:
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15647264
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Filing Dt:
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07/12/2017
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Publication #:
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Pub Dt:
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01/18/2018
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Inventors:
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Kuo-Shu Kao, Tao-Chih Chang, Yu-Min Lin, Jing-Yao Chang
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Title:
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CHIP PACKAGING AND COMPOSITE SYSTEM BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, |
| HSINCHU, TAIWAN 31040 |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
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