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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
15230254
Filing Dt:
08/05/2016
Publication #:
Pub Dt:
02/08/2018
Inventors:
Shih-Chung KON, Milan PLISKA, Bernhard LOIDL, Michael BRUGGER
Title:
APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
Assignment: 1
Reel/Frame:
039373/0290Recorded: 08/08/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/18/2016
Exec Dt:
05/23/2016
Exec Dt:
05/18/2016
Exec Dt:
05/17/2016
Assignee:
SEZ STRASSE 1
VILLACH, AUSTRIA A-9500
Correspondent:
YOUNG & THOMPSON
209 MADISON STREET
SUITE 500
ALEXANDRIA, VA 22314

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