Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/18/2020
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Application #:
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15664156
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Filing Dt:
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07/31/2017
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Publication #:
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Pub Dt:
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02/15/2018
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Inventors:
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Guan-Syun Tseng, Ju-Ming Huang, Tsung-Hsien Lin, Chang-Chien Yang, Chih-Wei Liao
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Title:
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Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Prepared Using the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 803, PO AI ST. |
| CHUPEI CITY, HSINCHU COUNTY, TAIWAN |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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