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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/28/2018
Application #:
15663304
Filing Dt:
07/28/2017
Publication #:
Pub Dt:
02/22/2018
Inventors:
Yong Ho BAEK, Jung Hyun CHO, Byoung Chan KIM
Title:
FAN-OUT SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
043134/0160Recorded: 07/28/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/23/2017
Exec Dt:
06/23/2017
Exec Dt:
06/23/2017
Assignee:
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MCDERMOTT WILL & EMERY LLP
500 CAPITOL STREET NW
WASHINGTON, DC 20001

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