Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/05/2019
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Application #:
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15482982
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Filing Dt:
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04/10/2017
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Publication #:
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Pub Dt:
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03/01/2018
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Inventors:
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Le LIANG, Chaofeng CAI, Yan CHEN
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Title:
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INTERLEAVED PARALLEL CIRCUIT, INTEGRATED POWER MODULE AND INTEGRATED POWER CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1F&7F&8F, BUILDING 1, NO.1675 HUADONG ROAD, PUDONG |
SHANGHAI, CHINA 201209 |
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YUNLING REN |
C/O EATON & VAN WINKLE |
3 PARK AVENUE |
NEW YORK, NY 10016 |
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